A wire bonder is a system that connects wires for electrical conduction between a silicon chip, the core of an IC or LSI, and a lead frame. Currently, the method of using ultrasonic waves is common in wire bonding. Since the state of applying ultrasonic vibration affects the quality of bonding, it has been highlighted as an important parameter.
- Ball bonding
- Wedge bonding
- TAB method
- Flip chip method Etc.
Thermo-compression bonding / Thermosonic bonding
: Spot welding using heat. Using a gold wire, press and connect applying a constant load, heat, and ultrasonic vibration (when thermosonic bonding) to the wire
Ultrasonic wedge bonding
: Bonding method by friction welding. Ultrasonic vibration is applied to the aluminum wire with applying a certain load. It is mainly used when manufacturing power modules and automotive ICs.
6-1 Vibration measurement during test drive (static check)
6-2 Vibration measurement during tool crimping (dynamic measurement)
6-3 Tool vibration mode measurement
6-4 Lead frame resonance measurement
- Copyright © ONO SOKKI CO.,LTD All Rights Reserved.