This example shows how to measure the
thickness of curved plate material including silicon
wafer with high accuracy. Specialized stand is used to
prevent an influence of curve, which is designed to have
convex lens where the measurement tip is hit, and four
pins around the lens in order to hold up the curved
plate material stably. Adjusting to fit the center of
measurement tip for GS-3813 gauge sensor and convex
lens, the thickness can be measured with less influence of curve.
The second processing including
statistical processing can be performed by transferring
the measured data to PC via RS-232C interface.