Applications Dimension
Inspection / testing of part
A-1-1
OK/NG decision of small parts’ dimension
A-1-2
Testing for surface asperity or skew of disc
Dimensional inspection and screening of parts
A-2-1
Flatness measurement of metallic parts (precision gear etc.)
A-2-2
Measuring and screening for height of small parts such as IC packages
A-2-3
Measurement of unevenness and screening of metallic parts
A-2-4
Testing the deformation of bearing case after quenching treatment
A-2-5
Measuring the height of rivet/screw
A-2-6
Measuring the height of battery
A-2-7
Measuring the height of swaging part such as crimp-type terminal
Shape measurement of large structure / Measuring the dimension of automobile parts
B-1-1
Measurement and detection of copper plate squareness
B-1-2
Measuring the distortion of casting product including die-cast Measuring the curved surface of automobile glass
B-3-1
Measuring the flatness of camshaft
B-3-2
Measuring the squareness of cylindrical component
Measurement of uneven thickness, mold and board shape
B-2-1
Rank differentiation of balls on production line
B-2-2
Measuring the thickness/uneven thickness of glassware such as beaker or resin pipe
B-2-3
Measuring the dimension of a tile matrix
B-2-4
Measuring the thickness of belting
Displacement measurement of automobile-related components
C-1-1
Measuring the strength of automobile outer frame
C-1-2
Measuring the deflection of tire per rotation
C-2-1
Measuring the thickness of material such as glass wool, felt, cloth etc.
C-2-3
Testing the load-strength of construction / civil engineering material 2
(multipoint measurement)
Displacement measurement of metallic parts / Measurement of shaft deflection / Measurement of automated machine
C-3-1
Measuring the compressed displacement of bellows / spring
C-4-1
Measuring the deflection of motor shaft
C-4-2
Contact measurement of the roll gap of steel plate rolling machine
C-5-1
Measuring the stroke of automated machine
Measurement of optical glass part / Thickness measurement of silicon wafer / Measurement of electronic industrial film
D-1-1
Dimensional measurement with high accuracy
D-2-1
Thickness measurement of silicon wafer with an accuracy of 0.5μm
D-2-2
Thickness measurement of curved material such as silicon wafer with high accuracy
Non-contact thickness measurement
E-1-1
Non-contact thickness measurement of electronic material such as silicon wafer with high accuracy
E-2-1
Non-contact thickness measurement of steel plate during running operation
E-2-2
Non-contact thickness measurement of steel plate during running operation-2
E-3-1
Non-contact thickness measurement of copper-clad laminated board on a production line
E-4-1
Non-contact thickness measurement of film on a production line